MFS2303BMBA3EPR2
MFS2303BMBA3EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
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The NXP USA Inc. MFS2303BMBA3EPR2 is a System Basis Chip designed for high-reliability applications. This component features a voltage supply range of 5.5V to 40V and a low supply current of 40µA. It is housed in a 48-HVQFN (7x7) package, specifically a 48-VFQFN Exposed Pad, suitable for surface mount installation with wettable flanks. The operating temperature range is -40°C to 125°C (TA). This device is commonly utilized in automotive and industrial systems. The MFS2303BMBA3EPR2 is supplied in Tape & Reel (TR) packaging.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 5.5V ~ 40V |
| Applications | System Basis Chip |
| Current - Supply | 40µA |
| Supplier Device Package | 48-HVQFN (7x7) |
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