MFS2303BMBA3EP
MFS2303BMBA3EPManufacturer: NXP USA Inc.
Categories: Specialized
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The NXP USA Inc. MFS2303BMBA3EP is a System Basis Chip (SBC) designed for demanding applications. This component, housed in a 48-HVQFN (7x7) package, offers a wide input voltage range of 5.5V to 40V and operates with a low supply current of 40µA. Its surface mount, wettable flank mounting type facilitates robust assembly processes. The MFS2303BMBA3EP is engineered for reliable performance across an operating temperature range of -40°C to 125°C (TA). This device is suitable for use in automotive and industrial systems requiring sophisticated power management and control functionalities.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 5.5V ~ 40V |
| Applications | System Basis Chip |
| Current - Supply | 40µA |
| Supplier Device Package | 48-HVQFN (7x7) |
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