MFS2300BMBA0EPR2
MFS2300BMBA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2300BMBA0EPR2 is a System Basis Chip (SBC) designed for advanced power management applications. This component offers a wide supply voltage range from 5.5V to 40V, making it suitable for demanding automotive and industrial systems. Featuring a low supply current of 40µA, it optimizes power efficiency in battery-powered or power-constrained designs. The SBC is housed in a 48-HVQFN (7x7) package with an exposed pad for enhanced thermal performance and is provided in Tape & Reel (TR) packaging for automated assembly. Its surface mount, wettable flank mounting type ensures robust solder joints. Operating across a temperature range of -40°C to 125°C (TA), the MFS2300BMBA0EPR2 is engineered for reliability in harsh environments. This component is integral to applications requiring sophisticated power sequencing, voltage regulation, and system monitoring.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 5.5V ~ 40V |
| Applications | System Basis Chip |
| Current - Supply | 40µA |
| Supplier Device Package | 48-HVQFN (7x7) |
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