NXP USA Inc. presents the FS6500, a System Basis Chip designed for demanding automotive applications. This advanced PMIC (Power Management Integrated Circuit) is housed in a 48-HLQFP (7x7) package, featuring an exposed pad for enhanced thermal performance. Qualified to AEC-Q100 standards, the FS6500 operates reliably across a wide temperature range of -40°C to 150°C. Its surface mount configuration is ideal for high-density board designs. The device supports supply voltages from 1V to 5V, making it a versatile solution for power management in automotive electronic control units (ECUs), infotainment systems, and advanced driver-assistance systems (ADAS). This component is supplied in Tape & Reel packaging for efficient manufacturing processes.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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