NXP USA Inc. presents the MC35FS6512CAER2, a System Basis Chip (SBC) designed for demanding automotive applications. This highly integrated component simplifies system design by consolidating multiple power management and control functions onto a single device. Featuring a 48-HLQFP (7x7) package with an exposed pad for enhanced thermal performance, the MC35FS6512CAER2 operates within a wide temperature range of -40°C to 150°C. Its voltage supply capabilities range from 1V to 5V, and it is qualified to AEC-Q100 standards, ensuring reliability in automotive environments. The FS6500 series device is designed for surface mount installation and is supplied in tape and reel packaging. This component is instrumental in modern automotive electronic control units (ECUs) and advanced driver-assistance systems (ADAS).
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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