NXP USA Inc. presents the MC35FS6510CAER2, a System Basis Chip (SBC) designed for demanding automotive applications. This component, part of the FS6500 family, integrates multiple power management and communication functions into a single package. Featuring a 48-HLQFP (7x7) exposed pad package, it is suitable for surface mount assembly and supplied on tape and reel. The MC35FS6510CAER2 operates over a wide temperature range of -40°C to 150°C (TA) and supports supply voltages from 1V to 5V. Its AEC-Q100 qualification underscores its suitability for the rigorous requirements of the automotive industry, including use in infotainment systems, advanced driver-assistance systems (ADAS), and body control modules.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
Request a Quote
Clients Also Buy
MC34PF1510A7EPR2
PF1510
MFS2601AMBA0ADR2
AUTO SBC
MC33PF8200DNES
POWER MANAGEMENT IC I.MX8 PRE-PR
