NXP USA Inc. MC35FS6503CAER2 is a System Basis Chip designed for demanding automotive applications. This component, part of the FS6500 family, integrates multiple power management functions into a single 48-HLQFP package with an exposed pad for enhanced thermal performance. It features a wide operating voltage range of 1V to 5V and operates reliably across an extended temperature spectrum from -40°C to 150°C. Qualified to AEC-Q100 standards, the MC35FS6503CAER2 is suitable for use in critical automotive systems. The device is supplied in Tape & Reel packaging for efficient surface mount assembly.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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