NXP USA Inc. presents the MC35FS6502NAE, a System Basis Chip (SBC) designed for demanding automotive applications. This component, part of the FS6500 family, integrates multiple power management and control functions essential for modern vehicle architectures. The 48-HLQFP (7x7) package with an exposed pad ensures robust thermal performance and reliable surface mount assembly. Operating across a wide supply voltage range of 1V to 5V and an extended temperature range of -40°C to 150°C, the MC35FS6502NAE meets stringent AEC-Q100 qualification standards. Its versatility makes it suitable for a broad spectrum of automotive systems, including infotainment, advanced driver-assistance systems (ADAS), and body control modules.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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