NXP USA Inc. presents the MC35FS6502CAER2, a System Basis Chip from the FS6500 family. This advanced power management integrated circuit is designed for demanding automotive applications, meeting AEC-Q100 qualification standards. The device features a robust operating temperature range of -40°C to 150°C, making it suitable for harsh environmental conditions. Packaged in a 48-HLQFP with an exposed pad, this surface-mount component offers a flexible supply voltage range from 1V to 5V. Its compact 7x7mm footprint and tape and reel packaging facilitate efficient integration into high-volume manufacturing processes. The MC35FS6502CAER2 is engineered to provide comprehensive power control and monitoring functionalities essential for modern automotive electronic systems.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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