The NXP USA Inc. MC35FS6501NAER2 is a System Basis Chip designed for automotive applications. This component, part of the FS6500 family, offers a robust solution for power management and system control. Featuring a 48-HLQFP (7x7) package with an exposed pad, it ensures efficient thermal dissipation. The MC35FS6501NAER2 operates over a wide temperature range of -40°C to 150°C (TA) and supports supply voltages from 1V to 5V. Its surface mount design and qualification to AEC-Q100 standards make it suitable for demanding automotive environments. This device is commonly utilized in automotive systems requiring integrated power and control functions. It is supplied in Tape & Reel (TR) packaging.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 39 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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