NXP USA Inc. presents the MC35FS6501CAER2, a System Basis Chip designed for demanding automotive applications. This component is built to the stringent AEC-Q100 qualification standard, ensuring reliability in harsh operating environments. Featuring a 48-HLQFP (7x7) package with an exposed pad for enhanced thermal performance, it offers a surface mount solution suitable for high-density board designs. The MC35FS6501CAER2 operates across a wide temperature range of -40°C to 150°C (TA) and supports supply voltages from 1V to 5V. Its primary function as a System Basis Chip makes it integral to power management and control systems in automotive powertrains, infotainment, and advanced driver-assistance systems (ADAS). Supplied in Tape & Reel (TR) packaging, this component is ready for high-volume manufacturing.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 39 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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