NXP USA Inc. presents the MC35FS4503NAE, a System Basis Chip designed for demanding automotive applications. This component, also referred to by its series designation FS4500, is built to Automotive AEC-Q100 qualification standards, ensuring reliability in harsh operating environments. The MC35FS4503NAE features a 48-HLQFP (7x7) package with an exposed pad for efficient thermal management, suitable for surface mount assembly. It operates within a broad temperature range of -40°C to 150°C and supports supply voltages from 1V to 5V. This versatile chip is integral to power management and system control in automotive platforms, contributing to the functionality of infotainment systems, advanced driver-assistance systems (ADAS), and body electronics.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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