MC33PF8200DNES
POWER MANAGEMENT IC I.MX8 PRE-PRManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MC33PF8200DNES is a high-performance power management IC designed for demanding applications. This component is engineered to support i.MX 8 and S32x processor-based systems, providing robust power control and distribution. Packaged in a 56-HVQFN (8x8) format with wettable flanks for enhanced solder joint reliability, it offers a surface mount solution. The MC33PF8200DNES operates within a supply voltage range of 2.5V to 5.5V and functions across an industrial temperature range of -40°C to 105°C. Its intended applications include advanced automotive systems and high-performance embedded computing platforms where efficient and reliable power management is critical. Supplied in trays, this device is suitable for high-volume manufacturing.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 39 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Voltage - Supply | 2.5V ~ 5.5V |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Current - Supply | - |
| Supplier Device Package | 56-HVQFN (8x8) |
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