MC33PF8200DFES
I.MX8QXP WITH DDR3LManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. presents the MC33PF8200DFES, a high-performance power management integrated circuit designed to support i.MX 8 and S32x processor families. This component, housed in a 56-HVQFN (8x8) package with wettable flanks for enhanced solder joint reliability, operates over a supply voltage range of 2.5V to 5.5V. The MC33PF8200DFES is engineered for demanding applications, including automotive infotainment, industrial automation, and advanced driver-assistance systems. Its robust design ensures reliable operation within an ambient temperature range of -40°C to 105°C. The 56-VFQFN Exposed Pad package facilitates efficient thermal management. This device is supplied in trays.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Voltage - Supply | 2.5V ~ 5.5V |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Current - Supply | - |
| Supplier Device Package | 56-HVQFN (8x8) |
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