MC33PF8200DEESR2
POWER MANAGEMENT IC I.MX8 PRE-PRManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MC33PF8200DEESR2 is a High Performance Power Management IC designed for i.MX 8 and S32x processor-based applications. This component, supplied in a 56-HVQFN (8x8) package, features a surface mount, wettable flank mounting type for robust assembly. Operating within a temperature range of -40°C to 105°C (TA), it offers a supply voltage flexibility from 2.5V to 5.5V. The MC33PF8200DEESR2 is engineered to support demanding processing needs in sectors such as automotive, industrial automation, and high-performance computing. Its advanced power management capabilities are crucial for optimizing system efficiency and reliability in these critical applications. The component is provided in Tape & Reel (TR) packaging for high-volume manufacturing.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Voltage - Supply | 2.5V ~ 5.5V |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Current - Supply | - |
| Supplier Device Package | 56-HVQFN (8x8) |
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