MC33PF8200DEES
IC POWER MANAGEMENT I.MX8QXPManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. presents the MC33PF8200DEES, a specialized power management integrated circuit designed for high-performance embedded systems. This component is engineered to support processor families such as the i.MX 8 and S32x architectures, facilitating robust power delivery and management. Featuring a 56-HVQFN (8x8) exposed pad package, it is suitable for surface mount applications with wettable flanks, ensuring reliable solder joints. The MC33PF8200DEES operates within a supply voltage range of 2.5V to 5.5V and is specified for operation across an ambient temperature range of -40°C to 105°C. Its advanced functionality makes it a critical component in applications demanding sophisticated power sequencing and regulation, including automotive infotainment, industrial automation, and advanced driver-assistance systems.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Voltage - Supply | 2.5V ~ 5.5V |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Current - Supply | - |
| Supplier Device Package | 56-HVQFN (8x8) |