MC33PF8100F3ESR2
POWER MANAGEMENT IC, I.MX8, PRE-Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. presents the MC33PF8100F3ESR2, a power management integrated circuit designed for advanced processor applications. This component is qualified to AEC-Q100 standards, ensuring reliability for automotive environments. Operating within a supply voltage range of 2.5V to 5.5V, it exhibits a low supply current of 10µA. The MC33PF8100F3ESR2 is housed in a 56-HVQFN (8x8) package with an exposed pad, suitable for surface mount applications with wettable flanks. Its operating temperature range is -40°C to 105°C (TA). This device is supplied on a Tape & Reel (TR) for efficient manufacturing processes, supporting high-volume production.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 39 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Voltage - Supply | 2.5V ~ 5.5V |
| Applications | Processor |
| Current - Supply | 10µA |
| Supplier Device Package | 56-HVQFN (8x8) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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