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MC33FS8510D3KS

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MC33FS8510D3KS

SAFETY POWER MANAGEMENT IC, QFN5

Manufacturer: NXP USA Inc.

Categories: Specialized

Quality Control: Learn More

The NXP USA Inc. MC33FS8510D3KS is a System Basis Chip Power Management IC designed for demanding automotive applications. This component, housed in a 56-HVQFN (8x8) package with wettable flank surface mount capability, operates within a wide temperature range of -40°C to 125°C. It supports supply voltages up to 60V and draws a quiescent current of 15mA. Qualified to AEC-Q100 standards, this device is engineered for reliability in automotive systems. Its functionality as a System Basis Chip makes it suitable for integration into complex automotive electronic architectures. The specific package configuration, 56-VFQFN Exposed Pad, facilitates efficient thermal management and robust soldering.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case56-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 125°C (TA)
Voltage - Supply60V
ApplicationsSystem Basis Chip
Current - Supply15mA
Supplier Device Package56-HVQFN (8x8)
GradeAutomotive
QualificationAEC-Q100

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