MC33FS8510C4KSR2
FS8500 C0Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. FS8500 C0, part number MC33FS8510C4KSR2, is a System Basis Chip designed for demanding automotive applications. This component features a 56-HVQFN (8x8) package with wettable flank surface mount capability, ensuring robust assembly. Operating within a -40°C to 125°C temperature range, it supports supply voltages up to 60V and draws a nominal 15mA supply current. Qualified to AEC-Q100 standards, this device is suitable for use in critical automotive systems requiring high reliability and performance. The exposed pad on the 56-VFQFN package facilitates effective thermal management.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 60V |
| Applications | System Basis Chip |
| Current - Supply | 15mA |
| Supplier Device Package | 56-HVQFN (8x8) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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