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MC33FS8510B6KSR2

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MC33FS8510B6KSR2

FS8500 C0

Manufacturer: NXP USA Inc.

Categories: Specialized

Quality Control: Learn More

The NXP USA Inc. MC33FS8510B6KSR2 is a System Basis Chip designed for automotive applications. This component integrates multiple power management and control functions into a single package. Featuring a 60V supply voltage capability and a low 15mA quiescent current, it is suitable for demanding automotive environments. The MC33FS8510B6KSR2 is AEC-Q100 qualified and operates across a temperature range of -40°C to 125°C. It is supplied in a 56-VFQFN Exposed Pad package, specifically a 56-HVQFN (8x8) according to the supplier device package, designed for surface mount installation with wettable flanks. This device is commonly utilized in automotive powertrain, chassis control, and body electronics systems.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ActivePackaging: Tape & Reel (TR)Datasheet:
Technical Details:
PackagingTape & Reel (TR)
Package / Case56-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 125°C (TA)
Voltage - Supply60V
ApplicationsSystem Basis Chip
Current - Supply15mA
Supplier Device Package56-HVQFN (8x8)
GradeAutomotive
QualificationAEC-Q100

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