The NXP USA Inc. MC33FS8510B6KS is a System Basis Chip designed for demanding automotive applications. This advanced power management integrated circuit offers a 60V supply voltage capability and operates efficiently with a 15mA quiescent current. Featuring a 56-HVQFN (8x8) package with wettable flank surface mount technology, it ensures robust and reliable integration into complex PCB designs. Qualified to AEC-Q100 standards for automotive reliability, this component is engineered for operation across an extended temperature range of -40°C to 125°C. Its comprehensive feature set makes it suitable for a variety of automotive systems, including powertrain management, body control modules, and advanced driver-assistance systems (ADAS).
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 60V |
| Applications | System Basis Chip |
| Current - Supply | 15mA |
| Supplier Device Package | 56-HVQFN (8x8) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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