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MC33FS8410G3ES

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MC33FS8410G3ES

SYSTEM BASIS CHIP FS8410

Manufacturer: NXP USA Inc.

Categories: Specialized

Quality Control: Learn More

NXP USA Inc. presents the MC33FS8410G3ES, a System Basis Chip designed for demanding applications. This component integrates multiple power management functions within a compact 56-HVQFN (8x8) package, featuring wettable flanks for enhanced solder joint reliability. With a wide operating voltage range up to 60V and a supply current of 15mA, it is suitable for systems requiring robust power control and monitoring. The MC33FS8410G3ES operates reliably across an extended temperature range of -40°C to 125°C (TA). Its Surface Mount configuration, specifically the 56-VFQFN Exposed Pad, facilitates efficient board assembly. This device finds application in automotive and industrial systems demanding sophisticated power management for central control units and complex electronic architectures.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case56-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 125°C (TA)
Voltage - Supply60V
ApplicationsSystem Basis Chip
Current - Supply15mA
Supplier Device Package56-HVQFN (8x8)

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