MC33FS6527LAE
SYSTEM BASIS CHIP, DCDC 2.2A VCOManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. presents the MC33FS6527LAE, a System Basis Chip designed for demanding automotive applications. This device integrates multiple power management functions, including a 2.2A DC-DC converter, within a compact 48-HLQFP (7x7) package. Engineered for high reliability, it meets AEC-Q100 qualification standards, ensuring robust performance across its operating temperature range of -40°C to 125°C. The MC33FS6527LAE supports a supply voltage range of 1V to 5V and features a surface mount design for efficient integration into complex PCB layouts. Its exposed pad enhances thermal management. This component is suitable for advanced automotive systems requiring sophisticated power control and monitoring.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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