MC33FS6507LAER2
SYSTEM BASIS CHIP, DCDC 0.8A VCOManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MC33FS6507LAER2 is a System Basis Chip designed for automotive applications. This advanced power management integrated circuit integrates multiple functions, including a 0.8A DC-DC converter, to streamline system design and reduce component count. It features a broad input voltage range from 1V to 5V and operates within an ambient temperature range of -40°C to 125°C. The MC33FS6507LAER2 is supplied in a 48-HLQFP (7x7) package with an exposed pad for enhanced thermal performance, suitable for surface mount installation. This component meets the stringent AEC-Q100 qualification standards, making it ideal for demanding automotive environments.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 1V ~ 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HLQFP (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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