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MCZ33903BD3EKR2

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MCZ33903BD3EKR2

IC INTERFACE SPECIALIZED 32SOIC

Manufacturer: NXP USA Inc.

Categories: Specialized

Quality Control: Learn More

NXP USA Inc. MCZ33903BD3EKR2 is a System Basis Chip (SBC) designed for automotive applications. This specialized component provides a robust interface for communication protocols such as CAN and LIN, enabling seamless integration within complex vehicle architectures. Operating within a supply voltage range of 5.5V to 28V, the MCZ33903BD3EKR2 is housed in a 32-SSOP (0.295", 7.50mm Width) Exposed Pad package, suitable for surface mounting. Its exposed pad enhances thermal performance, crucial for high-reliability automotive electronics. This device is engineered for demanding automotive environments, supporting critical functions in powertrain control, body electronics, and advanced driver-assistance systems.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)
Technical Details:
PackagingTape & Reel (TR)
Package / Case32-SSOP (0.295"", 7.50mm Width) Exposed Pad
Mounting TypeSurface Mount
InterfaceCAN, LIN
Voltage - Supply5.5V ~ 28V
ApplicationsSystem Basis Chip
Supplier Device Package32-SSOP-EP

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