This NXP USA Inc. device, part number 88W8782-B0-NAPC-AZ, is a high-performance RF transceiver IC designed for advanced wireless applications. Housed in a 68-HVQFN (8x8) package with an exposed pad, this component ensures robust thermal management and signal integrity for surface mount assembly. Its versatile architecture supports a wide range of communication protocols, making it suitable for demanding industrial, automotive, and consumer electronics markets. The 68-VFQFN exposed pad package facilitates efficient soldering and reliable connectivity in complex PCB layouts. The device is supplied in tape and reel packaging for automated manufacturing processes.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ActivePackaging: Tape & Reel (TR)