Home

Products

Discrete Semiconductor Products

Diodes

RF Diodes

BAP70-03,115

Banner
productimage

BAP70-03,115

RF DIODE PIN 50V 500MW SOD323

Manufacturer: NXP USA Inc.

Categories: RF Diodes

Quality Control: Learn More

NXP USA Inc.'s BAP70-03-115 is a single PIN RF diode designed for demanding RF applications. This component operates with a maximum reverse voltage of 50V and a forward current handling of 100 mA, dissipating up to 500 mW. Its low capacitance of 0.25pF at 20V and 1MHz, coupled with a low resistance of 1.9 Ohms at 100 mA and 100 MHz, makes it suitable for high-frequency switching and attenuation circuits. The BAP70-03-115 is housed in a compact SOD-323 (SC-76) surface-mount package, supplied on tape and reel for automated assembly. It is engineered for operation across a wide temperature range of -65°C to 150°C. This diode finds application in various industries including telecommunications, wireless infrastructure, and consumer electronics.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)Datasheet:
Technical Details:
PackagingTape & Reel (TR)
Package / CaseSC-76, SOD-323
Diode TypePIN - Single
Operating Temperature-65°C ~ 150°C (TJ)
Capacitance @ Vr, F0.25pF @ 20V, 1MHz
Resistance @ If, F1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max)50V
Supplier Device PackageSOD-323
Current - Max100 mA
Power Dissipation (Max)500 mW

Request a Quote

Name (required)

Phone (required)

Work Email (required)

Country (required)

Company Name (required)

CAPTCHA

By providing a telephone number and submitting the form, you are consenting to be contacted by SMS text message and agreeing to our Privacy Policy. Message frequency may vary. Message and data rates may apply. Reply STOP to opt out of further messaging. Reply HELP for more information.
Clients Also Buy
NXP FAQs

NXP Semiconductors manufactures mixed-signal, analog, and embedded semiconductor components focused on secure connectivity and intelligent systems.

NXP’s core components include:

  • Microcontrollers (MCUs) and microprocessors (MPUs)
  • Automotive semiconductors (ADAS, radar, in-vehicle networking)
  • RF and wireless communication chips (including NFC and UWB)
  • Secure identification and authentication ICs
  • Power management and analog ICs
  • Sensors and interface solutions

NXP specializes in secure, connected solutions for automotive, industrial, and IoT applications.

NXP serves industries that require secure connectivity, embedded processing, and real-time control.

NXPs key industries include:

  • Automotive and electric vehicles (EVs)
  • Industrial automation and smart factories
  • Internet of Things (IoT) and smart devices
  • Mobile and secure identification (payments, access control)
  • Communications and networking infrastructure
  • Smart cities and infrastructure

These industries rely on NXP for security, connectivity, and high-reliability embedded solutions.

NXP is known for embedded processing, secure connectivity, and automotive semiconductor product lines.

Key NXP product lines include:

  • i.MX series - application processors for industrial and multimedia applications
  • MPC5500 - microcontrollers for automotive and industrial control applications
  • M68HC11- 8-bit microcontrollers for legacy embedded control systems
  • Layerscape processors - networking processors for communications infrastructure
  • Kinetis MCUs - scalable microcontrollers for industrial and IoT applications
  • LPC series - ARM-based microcontrollers for embedded systems
  • S32 automotive platform - processors and MCUs for automotive applications
  • PN series (NFC controllers) - near-field communication solutions
  • SR series (secure elements) - security ICs for authentication and payments
  • TEA series - power management ICs
Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.

Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.