NXP USA Inc. presents the MPC860DTZQ66D4, a powerful microprocessor designed for demanding applications. This component features a core speed of 66MHz, integrated within a 357-ball BGA package for high-density board layouts. The MPC860 series is recognized for its robust performance in embedded systems. This specific part, MPC860DTZQ66D4, is suitable for applications within the industrial automation, telecommunications infrastructure, and networking equipment sectors, where reliability and processing power are paramount. The component is supplied in tray packaging, ensuring efficient handling during high-volume manufacturing processes.
Additional Information
Series:RoHS Status:Manufacturer Lead Time:Product Status: ActivePackaging: Tray