MIMX8QX2AVOFZAC
I.MX8 QXP 17X17Manufacturer: NXP USA Inc.
Categories: Microprocessors
Quality Control: Learn More
The NXP USA Inc. MIMX8QX2AVOFZAC is a microprocessor IC featuring a 417-FBGA (17x17) package for surface mounting. This component is designed for demanding applications within the automotive and industrial sectors, leveraging advanced processing capabilities for complex tasks. Its robust design and high-density packaging make it suitable for integration into sophisticated electronic systems requiring efficient and reliable performance. The MIMX8QX2AVOFZAC is a key element for embedded solutions where advanced computation and connectivity are paramount.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 417-BFBGA |
| Mounting Type | Surface Mount |
| Speed | - |
| Operating Temperature | - |
| Core Processor | - |
| Voltage - I/O | - |
| Supplier Device Package | 417-FBGA (17x17) |
| Ethernet | - |
| USB | - |
| Number of Cores/Bus Width | - |
| Co-Processors/DSP | - |
| RAM Controllers | - |
| Graphics Acceleration | - |
| Display & Interface Controllers | - |
| Security Features | - |
| SATA | - |
| Additional Interfaces | - |
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