MIMX8QP6AVUFEAB
MIMX8QP6AVUFEABManufacturer: NXP USA Inc.
Categories: Microprocessors
Quality Control: Learn More
NXP USA Inc. MIMX8QP6AVUFEAB is a high-performance application processor designed for demanding embedded applications. This microprocessor utilizes a 1313-Ball Flip Chip Ball Grid Array (FCBGA) package, measuring 29x29 millimeters, ensuring robust surface mount integration. The MIMX8QP6AVUFEAB is engineered to deliver advanced processing capabilities suitable for industrial automation, advanced driver-assistance systems (ADAS), and sophisticated consumer electronics. Its architecture supports complex computational tasks and real-time processing requirements. The component is supplied in bulk packaging, facilitating large-scale production environments.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 1313-BFBGA |
| Mounting Type | Surface Mount |
| Supplier Device Package | 1313-BGA (29x29) |
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