MIMX8DX1AVOFZAC
I.MX 8DUALXPLUS 17X17Manufacturer: NXP USA Inc.
Categories: Microprocessors
Quality Control: Learn More
The NXP USA Inc. MIMX8DX1AVOFZAC is a microprocessor featuring a 417-FBGA (17x17) package. This electronic component is designed for advanced computing applications, commonly found in industrial automation, automotive systems, and high-performance embedded solutions. Its robust construction and specific pinout are tailored for demanding environments where reliability and precise signal integrity are paramount. The 17x17mm package size with 417 balls facilitates high-density board designs and efficient thermal management.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 417-BFBGA |
| Mounting Type | Surface Mount |
| Speed | - |
| Operating Temperature | - |
| Core Processor | - |
| Voltage - I/O | - |
| Supplier Device Package | 417-FBGA (17x17) |
| Ethernet | - |
| USB | - |
| Number of Cores/Bus Width | - |
| Co-Processors/DSP | - |
| RAM Controllers | - |
| Graphics Acceleration | - |
| Display & Interface Controllers | - |
| Security Features | - |
| SATA | - |
| Additional Interfaces | - |
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