MCM69R820CZP5
Late-Write SRAM, 256KX18, 2.5ns, BICMOS, PBGA119Manufacturer: NXP Semiconductors
Categories: SRAMs
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NXP Semiconductors MCM69R820CZP5 is a late-write BICMOS SRAM with a memory organization of 256K x 18. It offers a maximum access time of 2.5 ns, supporting high-speed data operations. This synchronous memory component operates from a nominal supply voltage of 3.3V, with a range of 3.135V to 3.465V. The MCM69R820 series SRAM is housed in a 119-ball PBGA (Plastic Ball Grid Array) package, featuring a rectangular shape and a terminal pitch of 1.270 mm. Its operating temperature range is from 0°C to 70°C. This component is suitable for applications in high-performance computing, networking infrastructure, and telecommunications systems where rapid data throughput and efficient memory access are critical.
Additional Information
Series: MCM69R820RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.0000 |
| Width | 14.0000 |
| Technology | BICMOS |
| Access_Time_Max | 2.5000000000000000 |
| JESD_30_Code | R-PBGA-B119 |
| Memory_Density | 4718592.0000000000000000 |
| Memory_IC_Type | LATE-WRITE SRAM |
| Memory_Organization | 256KX18 |
| Memory_Width | 18 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 119 |
| Number_of_Words | 262144.0000000000000000 |
| Number_of_Words_Code | 256k |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 2.4000 |
| Supply_Voltage_Max | 3.46500 |
| Supply_Voltage_Min | 3.13500 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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