MCM63F819KZP11
Cache SRAM, 256KX18, 11ns, CMOS, PBGA119Manufacturer: NXP Semiconductors
Categories: SRAMs
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NXP Semiconductors MCM63F819 series MCM63F819KZP11 is a 4Mb CMOS Cache SRAM with a 256K x 18 memory organization. This component features an 11ns maximum access time and operates synchronously with a flow-through architecture. The device is housed in a 119-ball PBGA (R-PBGA-B119) package with a 1.27mm terminal pitch. Operating within a supply voltage range of 3.135V to 3.6V, it supports a nominal 3.3V supply. The MCM63F819KZP11 is designed for surface mounting and operates across a temperature range of 0°C to 70°C. Applications for this high-speed SRAM include networking infrastructure, telecommunications equipment, and high-performance computing systems.
Additional Information
Series: MCM63F819RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.0000 |
| Width | 14.0000 |
| Technology | CMOS |
| Access_Time_Max | 11.0000000000000000 |
| Additional_Feature | FLOW-THROUGH ARCHITECTURE |
| JESD_30_Code | R-PBGA-B119 |
| Memory_Density | 4718592.0000000000000000 |
| Memory_IC_Type | CACHE SRAM |
| Memory_Organization | 256KX18 |
| Memory_Width | 18 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 119 |
| Number_of_Words | 262144.0000000000000000 |
| Number_of_Words_Code | 256k |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 2.4000 |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.13500 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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