MCM36F8DG10
SRAM Module, 256KX36, 10ns, BICMOSManufacturer: NXP Semiconductors
Categories: SRAMs
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The NXP Semiconductors MCM36F8DG10 is a 256K x 36 BICMOS SRAM module from the MCM36F8 series. This component offers a maximum access time of 10ns and operates synchronously. With a memory density of 9,437,184 bits and a memory organization of 256K x 36, it utilizes parallel data transfer. The module is designed for a supply voltage range of 3.135V to 3.600V, with a nominal voltage of 3.3V, and operates within a temperature range of 0°C to 70°C. It features a 144-terminal package with a rectangular shape and is suitable for applications in networking, telecommunications, and high-performance computing. The MCM36F8DG10 is built on BICMOS technology.
Additional Information
Series: MCM36F8RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 3.8000 |
| Technology | BICMOS |
| Length | 67.6000 |
| Access_Time_Max | 10.0000000000000000 |
| Additional_Feature | WD-MAX |
| JESD_30_Code | R-XZMA-N144 |
| Memory_Density | 9437184.0000000000000000 |
| Memory_IC_Type | SRAM MODULE |
| Memory_Organization | 256KX36 |
| Memory_Width | 36 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 144 |
| Number_of_Words | 262144.0000000000000000 |
| Number_of_Words_Code | 256k |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | UNSPECIFIED |
| Package_Code | DIMM |
| Package_Shape | Rectangular |
| Package_Style | MICROELECTRONIC ASSEMBLY |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 25.5500 |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.13500 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | No |
| Terminal_Form | NO LEAD |
| Terminal_Pitch | 0.800 |
| Terminal_Position | ZIG-ZAG |
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