XPC850DEZT66BU
RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA256Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors XPC850 Series XPC850DEZT66BU is a 32-bit, 66MHz CMOS RISC microprocessor. This component features a 32-bit external data bus and a 26-bit address bus, supporting applications requiring efficient data handling and memory access. The XPC850DEZT66BU includes integrated cache for enhanced performance and low-power modes for energy-sensitive designs. Its PBGA256 package, with a terminal pitch of 1.270mm, is a square, plastic/epoxy grid array measuring 23x23mm, designed for surface mounting. Operating within a temperature range of 0°C to 95°C, it requires a supply voltage of 3.3V (nominal), with a maximum of 3.465V and a minimum of 3.135V. Boundary scan functionality is supported. This microprocessor is suitable for use in industrial automation, networking infrastructure, and embedded control systems.
Additional Information
Series: XPC850RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Format | Fixed Point |
| Length | 23.0000 |
| Speed | 66.00000000 |
| Width | 23.0000 |
| Technology | CMOS |
| Address_Bus_Width | 26 |
| Bit_Size | 32 |
| Boundary_Scan | Yes |
| External_Data_Bus_Width | 32 |
| Integrated_Cache | Yes |
| JESD_30_Code | S-PBGA-B256 |
| Low_Power_Mode | Yes |
| Number_of_Terminals | 256 |
| Operating_Temperature_Max | 95.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 2.3500 |
| Supply_Voltage_Max | 3.4650 |
| Supply_Voltage_Min | 3.1350 |
| Supply_Voltage_Nom | 3.3000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROPROCESSOR, RISC |
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