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XPC755BRX400LE

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XPC755BRX400LE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360

Manufacturer: NXP Semiconductors

Categories: Microprocessors

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The NXP Semiconductors XPC755BRX400LE is a 32-bit RISC microprocessor from the XPC755 series, operating at a maximum clock speed of 400MHz. This component features a 360-ball Ceramic Grid Array (CBGA360) package with a terminal pitch of 1.27mm, designed for surface mounting. It incorporates integrated cache and supports low-power modes, operating within a supply voltage range of 1.9V to 2.1V. The microprocessor is manufactured using CMOS technology and offers boundary scan capabilities. Applications for this component are found in high-performance embedded systems, telecommunications infrastructure, and industrial control equipment. Its robust construction and advanced features make it suitable for demanding environments with an operating temperature range of 0°C to 105°C. The XPC755BRX400LE utilizes a 32-bit address bus and a 64-bit external data bus.

Additional Information

Series: XPC755RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:
Technical Details:
FormatFloating Point
Length25.0000
Width25.0000
TechnologyCMOS
Speed400.00000000
Address_Bus_Width32
Bit_Size32
Boundary_ScanYes
Clock_Frequency_Max100.0000000000000000
External_Data_Bus_Width64
Integrated_CacheYes
JESD_30_CodeS-CBGA-B360
Low_Power_ModeYes
Number_of_Terminals360
Operating_Temperature_Max105.0000
Operating_Temperature_Min0.0000
Package_Body_MaterialCERAMIC, METAL-SEALED COFIRED
Package_CodeBGA
Package_Equivalence_CodeBGA360,19X19,50
Package_ShapeSquare
Package_StyleGRID ARRAY
Seated_Height_Max3.2000
Supply_Voltage_Max2.1000
Supply_Voltage_Min1.9000
Supply_Voltage_Nom2.0000
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.270
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeMICROPROCESSOR, RISC

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