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XPC755BRX300LD

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XPC755BRX300LD

RISC Microprocessor, 300MHz, CMOS, CBGA360

Manufacturer: NXP Semiconductors

Categories: Microprocessors

Quality Control: Learn More

NXP Semiconductors XPC755 series RISC microprocessor, part number XPC755BRX300LD, offers a 300MHz clock speed. This CMOS component features a CBGA360 package with a rectangular grid array form factor, utilizing ball terminals on the bottom. Operating within a supply voltage range of 1.9V to 2.1V (nominal 2.0V), it employs a fixed-point format. The package body material is ceramic, metal-sealed cofired, and the component is surface mountable. Boundary scan capabilities are supported, though it does not feature integrated cache or low-power modes. This microprocessor is suitable for applications in networking, telecommunications, and industrial automation.

Additional Information

Series: XPC755RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:
Technical Details:
FormatFixed Point
Speed300.00000000
TechnologyCMOS
Boundary_ScanYes
Integrated_CacheNo
JESD_30_CodeR-CBGA-B360
Low_Power_ModeNo
Number_of_Terminals360
Package_Body_MaterialCERAMIC, METAL-SEALED COFIRED
Package_CodeBGA
Package_ShapeRectangular
Package_StyleGRID ARRAY
Supply_Voltage_Max2.1000
Supply_Voltage_Min1.9000
Supply_Voltage_Nom2.0000
Surface_MountYes
Terminal_FormBall
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeMICROPROCESSOR, RISC

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