XPC755BPX400LE
RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors XPC755 series XPC755BPX400LE is a 32-bit RISC microprocessor operating at 400MHz. This CMOS component features a 360-ball PBGA package with a terminal pitch of 1.27mm, offering a square grid array form factor. It supports a 32-bit address bus and a 64-bit external data bus. The XPC755BPX400LE includes integrated cache and low-power operating modes. Boundary scan functionality is present. This microprocessor is designed for applications requiring advanced processing capabilities, commonly found in networking, industrial control, and high-performance embedded systems. It operates within a temperature range of 0°C to 105°C with a nominal supply voltage of 2.0V, ranging from 1.9V to 2.1V.
Additional Information
Series: XPC755RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Format | Floating Point |
| Length | 25.0000 |
| Width | 25.0000 |
| Technology | CMOS |
| Speed | 400.00000000 |
| Address_Bus_Width | 32 |
| Bit_Size | 32 |
| Boundary_Scan | Yes |
| Clock_Frequency_Max | 100.0000000000000000 |
| External_Data_Bus_Width | 64 |
| Integrated_Cache | Yes |
| JESD_30_Code | S-PBGA-B360 |
| Low_Power_Mode | Yes |
| Number_of_Terminals | 360 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA360,19X19,50 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 2.7700 |
| Supply_Voltage_Max | 2.1000 |
| Supply_Voltage_Min | 1.9000 |
| Supply_Voltage_Nom | 2.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROPROCESSOR, RISC |
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