XPC755BPX300LD
RISC Microprocessor, 300MHz, CMOS, PBGA360Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors XPC755 series RISC microprocessor, part number XPC755BPX300LD, operates at 300MHz. This CMOS device utilizes a fixed-point architecture and is housed in a 360-ball PBGA (R-PBGA-B360) package with a rectangular grid array shape. It features a bottom-mounted ball terminal form and is designed for surface mounting. The supply voltage ranges from 1.9000V to 2.1000V, with a nominal value of 2.0000V. Boundary scan support is included. This microprocessor is suitable for applications in telecommunications, industrial automation, and embedded computing.
Additional Information
Series: XPC755RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Format | Fixed Point |
| Speed | 300.00000000 |
| Technology | CMOS |
| Boundary_Scan | Yes |
| Integrated_Cache | No |
| JESD_30_Code | R-PBGA-B360 |
| Low_Power_Mode | No |
| Number_of_Terminals | 360 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Supply_Voltage_Max | 2.1000 |
| Supply_Voltage_Min | 1.9000 |
| Supply_Voltage_Nom | 2.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROPROCESSOR, RISC |
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