T1023NSE7MQA
SoC, CMOS, PBGA525Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors T1023 series System-on-Chip (SoC), part number T1023NSE7MQA, is a CMOS device in a 525-ball plastic BGA (PBGA) package, adhering to the S-PBGA-B525 standard. This square, fine-pitch component features bottom-terminated balls with a 0.800mm terminal pitch. Operating within a 0°C to 105°C temperature range, it requires a supply voltage of 0.97V to 1.03V, with a nominal 1.00V. The package dimensions are 19.00mm by 19.00mm, with a maximum seated height of 2.07mm. This SoC is designed for surface mounting and finds application in industrial automation, networking, and embedded control systems.
Additional Information
Series: T1023RoHS Status: RoHS CompliantManufacturer Lead Time: 14Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 19.0000 |
| Width | 19.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B525 |
| Number_of_Terminals | 525 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HFBGA |
| Package_Equivalence_Code | BGA525,23X23,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| Seated_Height_Max | 2.0700 |
| Supply_Voltage_Max | 1.0300 |
| Supply_Voltage_Min | 0.9700 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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