T1013NSE7MNA
SoC, CMOS, PBGA525Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors T1013 System-on-Chip (SoC) in a 525-ball plastic, epoxy BGA package (JESD_30_Code S-PBGA-B525). This CMOS device operates within a temperature range of 0°C to 105°C, with a nominal supply voltage of 1.00V (min 0.97V, max 1.03V). Featuring a terminal pitch of 0.800mm, it is designed for surface mounting with a seated height not exceeding 2.07mm. The T1013 series SoC is suitable for applications in networking, industrial control, and advanced driver-assistance systems (ADAS).
Additional Information
Series: T1013RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 19.0000 |
| Technology | CMOS |
| Length | 19.0000 |
| JESD_30_Code | S-PBGA-B525 |
| Number_of_Terminals | 525 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HFBGA |
| Package_Equivalence_Code | BGA525,23X23,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| Seated_Height_Max | 2.0700 |
| Supply_Voltage_Max | 1.0300 |
| Supply_Voltage_Min | 0.9700 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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