P5010NSN1MMB
SoC, CMOS, PBGA1295Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors P5010 series System on Chip (SoC), part number P5010NSN1MMB. This CMOS device features a S-PBGA-B1295 package with 1295 terminals arranged in a 1.00mm pitch bottom-entry ball grid array. The square package measures 37.50mm x 37.50mm with a maximum seated height of 3.53mm. It operates within a temperature range of 0°C to 105°C and utilizes a nominal supply voltage of 1.00V, with a minimum of 0.95V and a maximum of 1.05V. The plastic/epoxy package body is suitable for surface mounting applications. This SoC is commonly found in networking, industrial control, and aerospace applications.
Additional Information
Series: P5010RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 37.5000 |
| Technology | CMOS |
| Length | 37.5000 |
| JESD_30_Code | S-PBGA-B1295 |
| Number_of_Terminals | 1295 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA1295,36X36,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 3.5300 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |