MPC8377VRANFA
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8377VRANFA is a high-performance CMOS System-on-Chip (SoC) designed for demanding applications. This component, part of the MPC8377 series, features a 689-ball Plastic Ball Grid Array (PBGA) package with a terminal pitch of 1.000mm and a square grid array outline measuring 31.000mm x 31.000mm. It operates within a temperature range of 0°C to 125°C and supports a supply voltage range from 1.000V to 1.100V, with a nominal value of 1.050V. The device is manufactured using advanced CMOS technology and is suitable for surface mounting. Its robust construction and integrated capabilities make it a key component in telecommunications, industrial control, and networking infrastructure.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.1000 |
| Supply_Voltage_Min | 1.0000 |
| Supply_Voltage_Nom | 1.0500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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