MPC8377VRAGFA
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8377VRAGFA is a high-performance CMOS System-on-Chip (SoC) from the MPC8377 series. This component features a 689-ball Plastic Ball Grid Array (PBGA) package with a terminal pitch of 1.000 mm, conforming to the S-PBGA-B689 standard. Its square package shape and GRID ARRAY, HEAT SINK/SLUG style facilitate efficient thermal management. Operating within a range of 0°C to 125°C, this device supports a nominal supply voltage of 1.000 V, with a minimum of 0.950 V and a maximum of 1.050 V. The package body material is PLASTIC/EPOXY, and it is designed for surface mounting with a maximum seated height of 2.4600 mm. This SoC is utilized in applications such as networking infrastructure, industrial automation, and embedded systems requiring robust processing capabilities.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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