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MPC8377EVRANG

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MPC8377EVRANG

SoC, CMOS, PBGA689

Manufacturer: NXP Semiconductors

Categories: Microprocessors

Quality Control: Learn More

NXP Semiconductors MPC8377 series System-on-Chip (SoC), part number MPC8377EVRANG, is a CMOS device packaged in a 689-ball, plastic-encapsulated Ball Grid Array (PBGA) with a heat sink. This square-shaped HBGA package, with a terminal pitch of 1.00 mm, features bottom-terminated balls and a maximum seated height of 2.46 mm. Operating within a temperature range of 0°C to 125°C, this SoC supports a nominal supply voltage of 1.05V, with a minimum of 1.0V and a maximum of 1.10V. Applications for this component span networking, industrial control, and embedded computing systems.

Additional Information

Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:
Technical Details:
Length31.0000
Width31.0000
TechnologyCMOS
JESD_30_CodeS-PBGA-B689
Number_of_Terminals689
Operating_Temperature_Max125.0000
Operating_Temperature_Min0.0000
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeHBGA
Package_Equivalence_CodeBGA689,29X29,40
Package_ShapeSquare
Package_StyleGRID ARRAY, HEAT SINK/SLUG
Seated_Height_Max2.4600
Supply_Voltage_Max1.1000
Supply_Voltage_Min1.0000
Supply_Voltage_Nom1.0500
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.000
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeSoC

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