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MPC8377EVRAJFA

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MPC8377EVRAJFA

SoC, CMOS, PBGA689

Manufacturer: NXP Semiconductors

Categories: Microprocessors

Quality Control: Learn More

NXP Semiconductors MPC8377 series System-on-Chip (SoC) component, part number MPC8377EVRAJFA. This CMOS-based SoC is housed in a 689-ball PBGA (Plastic Ball Grid Array) package with a JEDEC standard S-PBGA-B689 code, measuring 31mm x 31mm with a seated height not exceeding 2.46mm. It operates within a temperature range of 0°C to 125°C and features a nominal supply voltage of 1.00V, with a maximum of 1.05V and a minimum of 0.95V. The component utilizes ball terminals with a 1.00mm pitch, positioned on the bottom of the square package. This device is suitable for surface-mount applications and is commonly found in networking infrastructure, industrial automation, and telecommunications equipment.

Additional Information

Series: MPC8377RoHS Status: RoHS CompliantManufacturer Lead Time: 52Product Status: DiscontinuedPackaging: TrayDatasheet:
Technical Details:
Length31.0000
Width31.0000
TechnologyCMOS
JESD_30_CodeS-PBGA-B689
Number_of_Terminals689
Operating_Temperature_Max125.0000
Operating_Temperature_Min0.0000
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeHBGA
Package_Equivalence_CodeBGA689,29X29,40
Package_ShapeSquare
Package_StyleGRID ARRAY, HEAT SINK/SLUG
Seated_Height_Max2.4600
Supply_Voltage_Max1.0500
Supply_Voltage_Min0.9500
Supply_Voltage_Nom1.0000
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.000
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeSoC

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