MPC8377EVRAJFA
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8377 series System-on-Chip (SoC) component, part number MPC8377EVRAJFA. This CMOS-based SoC is housed in a 689-ball PBGA (Plastic Ball Grid Array) package with a JEDEC standard S-PBGA-B689 code, measuring 31mm x 31mm with a seated height not exceeding 2.46mm. It operates within a temperature range of 0°C to 125°C and features a nominal supply voltage of 1.00V, with a maximum of 1.05V and a minimum of 0.95V. The component utilizes ball terminals with a 1.00mm pitch, positioned on the bottom of the square package. This device is suitable for surface-mount applications and is commonly found in networking infrastructure, industrial automation, and telecommunications equipment.
Additional Information
Series: MPC8377RoHS Status: RoHS CompliantManufacturer Lead Time: 52Product Status: DiscontinuedPackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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