MPC8377ECVRANF
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8377 series System-on-Chip (SoC) in a 689-ball plastic ball grid array (PBGA) package. This CMOS device operates within a temperature range of -40°C to 125°C and features a supply voltage of 1.00V to 1.10V with a nominal 1.05V. The MPC8377ECVRANF is designed for demanding applications, commonly found in networking infrastructure, industrial automation, and storage systems. Its square package, measuring 31.00mm x 31.00mm with a seated height of 2.46mm, utilizes a 1.00mm terminal pitch. This surface-mount component is built with plastic/epoxy material and incorporates a heat sink for thermal management.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.1000 |
| Supply_Voltage_Min | 1.0000 |
| Supply_Voltage_Nom | 1.0500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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