MPC8377ECVRANDA
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8377 Series SoC, part number MPC8377ECVRANDA, is a high-performance, low-power CMOS System-on-Chip designed for demanding applications. This device features a 689-ball PBGA package with a terminal pitch of 1.000mm, offering a robust and compact footprint for dense board designs. Operating within a temperature range of -40°C to 125°C, it supports supply voltages from 1.000V to 1.100V, with a nominal voltage of 1.050V. The MPC8377ECVRANDA is suitable for integration into networking infrastructure, industrial control systems, and advanced storage solutions. Its advanced architecture and comprehensive peripheral set facilitate efficient data processing and connectivity.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.1000 |
| Supply_Voltage_Min | 1.0000 |
| Supply_Voltage_Nom | 1.0500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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