MPC8377ECVRAND
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
Quality Control: Learn More
NXP Semiconductors presents the MPC8377ECVRAND, a high-performance CMOS System-on-Chip (SoC) from the MPC8377 series. This device features a 689-ball land grid array (LGBA) package, identified by the S-PBGA-B689 code, with a terminal pitch of 1.000mm. Operating within a temperature range of -40°C to 125°C, it supports a supply voltage from 1.000V to 1.100V, with a nominal voltage of 1.05V. The square package measures 31.000mm by 31.000mm, with a maximum seated height of 2.4600mm. This surface-mount component utilizes ball terminals and is suitable for applications in networking, telecommunications, and industrial automation.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.1000 |
| Supply_Voltage_Min | 1.0000 |
| Supply_Voltage_Nom | 1.0500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
Request a Quote
Clients Also Buy
MPC8377EVRANF
SoC, CMOS, PBGA689
MPC8377EVRAGFA
SoC, CMOS, PBGA689
MPC8377EVRAGF
SoC, CMOS, PBGA689