MPC8377ECVRAJG
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8377 series SoC, part number MPC8377ECVRAJG, is a high-performance, low-power CMOS device. This Ball Grid Array (BGA) component, specifically S-PBGA-B689, features 689 terminals with a 1.00mm pitch. Operating within a temperature range of -40°C to +125°C, it utilizes a nominal supply voltage of 1.00V, with a maximum of 1.05V and a minimum of 0.95V. The device is designed for surface mounting and offers a square package shape with a heat sink/slug, measuring 31.00mm x 31.00mm with a maximum seated height of 2.46mm. Applications span various industries including networking, industrial automation, and embedded computing systems requiring robust processing capabilities.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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